Meyer Burger Technology Ltd announces the successful signing of an important contract with SunEdison, for the delivery and commissioning of DW288 water-based diamond wire saws. After an extensive on-site equipment evaluation process, SunEdison selected Meyer Burger's diamond wire cutting technology for the production of its mono-crystalline silicon solar wafers. With its environmentally friendly water-based cutting technology, the DW288 enables the production of high-quality ultra-thin wafers at twice the cutting speed compared to the standard slurry wafering process. This significantly increases wafer output and maximizes equipment capacity.
"With their unique competencies in the development of high-tech equipment and their profound process insights, Meyer Burger is an ideal partner to SunEdison", stated Dave Ranhoff, President Solar Materials at SunEdison.
SunEdison is relying on Meyer Burger's diamond wire technology to help increase their wafering capacity to meet growing global demand for high performance, cost effective solar panels.
Michael Escher, CCO Meyer Burger, said: "This contract represents a further milestone in Meyer Burger's endeavors to support the technology change within the industry. We are proud to work with SunEdison as a long-term partner sharing a common commitment to the development of the renewable energy market. This achievement underlines our commitment and dedication to providing advanced high-tech solutions to leading companies in high-growth industries".
Delivery of the production equipment is scheduled to begin in the second quarter of 2015 with production at the customer's site scheduled to begin in the second half of 2015.